DIP

Dual Inline Package. A very common type of integrated circuit package, which can be either plastic (DIP-Plastic) or ceramic (CERDIP). Circuit leads or pins extend symmetrically outward and downward from opposite sides of the rectangular package body. Integrated circuits in BEAMbots generally have 0.1" (2.54 mm) spacing between pins in a row, and 0.3" (7.62 mm) spacing between rows of pins.

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For more basic information on integrated circuits, see the BEAM From the Ground Up section on ICs. For IC selection information (i.e., what ICs are commonly used in BEAMbots) and pricing comparisons, see the BEAM Pieces section on ICs here.


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Page author: Eric Seale  
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